eXtra Robustness ECC DRAM

DDR3

DDR3 ECC eX The I'M Intelligent Memory eXtra Robustness DRAMs offer the highest level of memory robustness for outstanding reliable applications. We have achieved this through adding a physical protection to the stored data-bits by holding the bits in larger capacitors, with a redundant data topology. This larger electric charge and redundant topology used to store the data-bit reduces the impact of typical DRAM cell leakage effects, thus leads to a significant higher robustness, safer data structure and data-retention capabilities to work even in roughest environments. On top comes our integrated ECC error correction which is able to automatically detect and correct single-bit errors.
I'M eXtra Robustness ECC DRAMs are direct drop-in-replacements for conventional DRAMs and do not require any software or hardware adaptions. The data-correction is performed by the DRAM itself without any noticable delays or latencies, and completely independent from the processor.

We offer our XR ECC DRAM products with operation temperature ranges up to 125° C (X-Grade).

Parametric DRAM Search DRAM Cross Reference Search ECC DRAM product brochure


Please click on the part number below to view its specifications and download the datasheet
  • Part No.
  • Capacity
  • Organization
  • Voltage
  • Package
  • Status
  • Speed
  • Temperature
  • Datasheet

IMX5116D3EEB

Technical Specifications

Capacity: 512Mb
Organization: x16
Package: FBGA 96
Voltage: 1.5V
Status: In Production
RoHS: Yes
Part No. Green Version: IMX5116D3EEBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667Mhz 1.5ns
DDR3-1600 800MHz 1.25ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp, H = High Temp, X = Extreme Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
H: -40°C to 105°C tC
X: -40°C to 125°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 1.0 / 01.04.2016
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IMX5108D3EEB

Technical Specifications

Capacity: 512Mb
Organization: x8
Package: FBGA 78
Voltage: 1.5V
Status: in production
RoHS: Yes
Part No. Green Version: IMX5108D3EEBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667Mhz 1.5ns
DDR3-1600 800MHz 1.25ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp, H = High Temp, X = Extreme Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
H: -40°C to105°C tC
X: -40°C to125°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 1.0 / 01.04.2016
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ECC Models

  • Part No.
  • Capacity
  • Organization
  • Voltage
  • Package
  • Status
  • Speed
  • Temperature
  • Datasheet

IME1G16D3EEB

Technical Specifications

Capacity: 1Gb
Organization: x16
Package: FBGA 96
Voltage: 1.5V
Status: In Production
RoHS: Yes
Part No. Green Version: IME1G16D3EEBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667Mhz 1.5ns
DDR3-1600 800MHz 1.25ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp, H = High Temp, X = Extreme Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
H: -40°C to 105°C tC
X: -40°C to 125°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 2.0 / 23.01.2017
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IME1G08D3EEB

Technical Specifications

Capacity: 1Gb
Organization: x8
Package: FBGA 78
Voltage: 1.5V
Status: In Production
RoHS: Yes
Part No. Green Version: IME1G08D3EEBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667Mhz 1.5ns
DDR3-1600 800MHz 1.25ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp, H = High Temp, X = Extreme Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
H: -40°C to105°C tC
X: -40°C to125°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 2.0 / 23.01.2017
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DRAM Models

  • Part No.
  • Capacity
  • Organization
  • Voltage
  • Package
  • Status
  • Speed
  • Temperature
  • Datasheet

IM8G04D3EBD

Technical Specifications

Capacity: 8Gb
Organization: x4/2CS
Package: FBGA 78 ball DDP
Voltage: 1.5V
Status: NRND **
RoHS: Yes
Compatible/
Cross to:
Micron MT41J2G4TRF, SK Hynix H5TQ8G43MMR, H5TQ8G43AMR, Samsung K4B8G0446B, K4B8G0446D
Part No. Green Version: IM8G04D3EBDG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 1.1 / 15.07.2015
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IM8G04D3FBD

Technical Specifications

Capacity: 8Gb
Organization: x4/2CS
Package: FBGA 78 ball DDP
Voltage: 1.35V
Status: NRND **
RoHS: Yes
Compatible/
Cross to:
Micron MT41K2G4TRF, SK Hynix H5TC8G43MMR, H5TC8G43AMR, Samsung K4B8G0446B, K4B8G0446D
Part No. Green Version: IM8G04D3FBDG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 1.2 / 15.07.2015
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IM8G04D3FCD

Technical Specifications

Capacity: 8Gb
Organization: x4/2CS
Package: FBGA 78 ball DDP
Voltage: 1.35V / (1.5V)
Status: In Production
RoHS: Yes
Compatible/
Cross to:
Micron MT41K2G4TRF, SK Hynix H5TC8G43MMR, H5TC8G43AMR, Samsung K4B8G0446B, K4B8G0446D
Part No. Green Version: IM8G04D3FCDG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 0.3 / 24.04.2017
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IM8G08D3EBB

Technical Specifications

Capacity: 8Gb
Organization: x8
Package: FBGA 78 ball
Voltage: 1.5V
Status: NRND **
RoHS: Yes
Part No. Green Version: IM8G08D3EBBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 1.2 / 15.07.2015
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IM8G08D3EBD

Technical Specifications

Capacity: 8Gb
Organization: x8/2CS
Package: FBGA 78 ball DDP
Voltage: 1.5V
Status: NRND **
RoHS: Yes
Compatible/
Cross to:
Micron MT41J1G8TRF, SK Hynix H5TQ8G83MMR, H5TQ8G83AMR, Samsung K4B8G0846B, K4B8G0846D
Part No. Green Version: IM8G08D3EBDG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 1.1 / 15.07.2015
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IM8G08D3FBB

Technical Specifications

Capacity: 8Gb
Organization: x8
Package: FBGA 78 ball
Voltage: 1.35V
Status: NRND **
RoHS: Yes
Part No. Green Version: IM8G08D3FBBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

Download

Datasheet
Datasheet version 1.2 / 15.07.2015
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IM8G08D3FBD

Technical Specifications

Capacity: 8Gb
Organization: x8/2CS
Package: FBGA 78 ball DDP
Voltage: 1.35V
Status: NRND **
RoHS: Yes
Compatible/
Cross to:
Micron MT41K1G8TRF, SK Hynix H5TC8G83MMR, H5TC8G83AMR, Samsung K4B8G0846B, K4B8G0846D
Part No. Green Version: IM8G08D3FBDG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 1.2 / 15.07.2015
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IM8G08D3FCB

Technical Specifications

Capacity: 8Gb
Organization: x8
Package: FBGA 78 ball
Voltage: 1.35V / (1.5V)
Status: CS* July 2017
RoHS: Yes
Part No. Green Version: IM8G08D3FCBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 0.1 / 10.05.2017
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IM8G08D3FCD

Technical Specifications

Capacity: 8Gb
Organization: x8/2CS
Package: FBGA 78 ball DDP
Voltage: 1.35V / (1.5V)
Status: In Production
RoHS: Yes
Compatible/
Cross to:
Micron MT41K1G8TRF, SK Hynix H5TC8G83MMR, H5TC8G83AMR, Samsung K4B8G0846B, K4B8G0846D
Part No. Green Version: IM8G08D3FCDG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 0.3 / 24.04.2017
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IM8G16D3EBB

Technical Specifications

Capacity: 8Gb
Organization: x16
Package: FBGA 96 ball
Voltage: 1.5V
Status: NRND **
RoHS: Yes
Part No. Green Version: IM8G16D3EBBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 0.4 / 15.07.2015
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IM8G16D3EBD

Technical Specifications

Capacity: 8Gb
Organization: x16/2CS
Package: FBGA 96 ball DDP
Voltage: 1.5V
Status: NRND **
RoHS: Yes
Compatible/
Cross to:
Micron MT41J512M16TNA, SK Hynix H5TQ8G63AMR, Samsung K4B8G1646B
Part No. Green Version: IM8G16D3EBDG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 0.3 / 22.08.2014
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IM8G16D3FBB

Technical Specifications

Capacity: 8Gb
Organization: x16
Package: FBGA 96 ball
Voltage: 1.35V
Status: NRND **
RoHS: Yes
Part No. Green Version: IM8G16D3FBBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 0.4 / 15.07.2015
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IM8G16D3FBD

Technical Specifications

Capacity: 8Gb
Organization: x16/2CS
Package: FBGA 96 ball DDP
Voltage: 1.35V
Status: NRND **
RoHS: Yes
Compatible/
Cross to:
Micron MT41K512M16TNA, SK Hynix H5TC8G63AMR, Samsung K4B8G1646B
Part No. Green Version: IM8G16D3FBDG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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IM8G16D3FCB

Technical Specifications

Capacity: 8Gb
Organization: x16
Package: FBGA 96 ball
Voltage: 1.35V / (1.5V)
Status: CS* July 2017
RoHS: Yes
Part No. Green Version: IM8G16D3FCBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 0.1 / 27.04.2017
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IM8G16D3FCD

Technical Specifications

Capacity: 8Gb
Organization: x16/2CS
Package: FBGA 96 ball DDP
Voltage: 1.35V / (1.5V)
Status: CS* July 2017
RoHS: Yes
Compatible/
Cross to:
Micron MT41K512M16TNA, SK Hynix H5TC8G63AMR, Samsung K4B8G1646B
Part No. Green Version: IM8G16D3FCDG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
Datasheet version 0.1 / 03.05.2017
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IM4G08D3EAB

Technical Specifications

Capacity: 4Gb
Organization: x8
Package: FBGA 78 ball
Voltage: 1.5V
Status: In Production
RoHS: Yes
Compatible/
Cross to:
Micron MT41J512M8RH, MT41J512M8RA, SK Hynix H5TQ4G83MFR, H5TQ4G83AFR, H5TQ4G83BFR, Samsung K4B4G0846Q, K4B4G0846B, K4B4G0846D
Part No. Green Version: IM4G08D3EABG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667Mhz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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Datasheet
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IM4G08D3FAB

Technical Specifications

Capacity: 4Gb
Organization: x8
Package: FBGA 78 ball
Voltage: 1.35V
Status: In Production
RoHS: Yes
Compatible/
Cross to:
Micron MT41K512M8RH, MT41K512M8RA, SK Hynix H5TC4G83MFR, H5TC4G83AFR, H5TC4G83BFR, Samsung K4B4G0846Q, K4B4G0846B, K4B4G0846D
Part No. Green Version: IM4G08D3FABG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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IM4G16D3EAB

Technical Specifications

Capacity: 4Gb
Organization: x16
Package: FBGA 96 ball
Voltage: 1.5V
Status: In Production
RoHS: Yes
Compatible/
Cross to:
Micron MT41J256M16HA, MT41J256M16RE, SK Hynix H5TQ4G63MFR, H5TQ4G63AFR, H5TQ4G63BFR, Samsung K4B4G1646Q, K4B4G1646B, K4B4G1646D
Part No. Green Version: IM4G16D3EABG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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IM4G16D3FAB

Technical Specifications

Capacity: 4Gb
Organization: x16
Package: FBGA 96 ball
Voltage: 1.35V
Status: In Production
RoHS: Yes
Compatible/
Cross to:
Micron MT41K256M16HA, MT41K256M16RE, SK Hynix H5TC4G63MFR, H5TC4G63AFR, H5TC4G63BFR, Samsung K4B4G1646Q, K4B4G1646B, K4B4G1646D
Part No. Green Version: IM4G16D3FABG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

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IM2G08D3FAB

Technical Specifications

Capacity: 2Gb
Organization: x8
Package: FBGA 78 ball
Voltage: 1.35V
Status: In Production
RoHS: Yes
Compatible/
Cross to:
Micron MT41J256M8 / SK-Hynix H5TQ2G83GFR / Samsung K4B2G0846
Part No. Green Version: IM2G08D3FABG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667Mhz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 105°C tC
tC = Operating Case temperature

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IM2G16D3EAB

Technical Specifications

Capacity: 2Gb
Organization: x16
Package: FBGA 96 ball
Voltage: 1.5V
Status: In Production
RoHS: Yes
Compatible/
Cross to:
Micron MT41J128M16 / SK-Hynix H5TQ2G63GFR / Samsung K4B2G1646
Part No. Green Version: IM2G16D3EABG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667Mhz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
DDR3-2133 1066MHz 0.938ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 105°C tC
tC = Operating Case temperature

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IM2G08D3EAB

Technical Specifications

Capacity: 2Gb
Organization: x8
Package: FBGA 78 ball
Voltage: 1.5V
Status: In Production
RoHS: Yes
Compatible/
Cross to:
Micron MT41J256M8 / SK-Hynix H5TQ2G83GFR / Samsung K4B2G0846
Part No. Green Version: IM2G08D3EABG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667Mhz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
DDR3-2133 1066MHz 0.938ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 105°C tC
tC = Operating Case temperature

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IM2G16D3FAB

Technical Specifications

Capacity: 2Gb
Organization: x16
Package: FBGA 96 ball
Voltage: 1.35V
Status: In Production
RoHS: Yes
Compatible/
Cross to:
Micron MT41J128M16 / SK-Hynix H5TQ2G63GFR / Samsung K4B2G1646
Part No. Green Version: IM2G16D3FABG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667Mhz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 105°C tC
tC = Operating Case temperature

Download

Datasheet
Datasheet version 1.0 / 06.11.2015
Part No. Decoder
Environmental Informations
REACH Notification
RoHS Notification
Statement Conflict Materials


Request Email

IM1G16D3EDB

Technical Specifications

Capacity: 1Gb
Organization: x16
Package: BGA96
Voltage: 1.5V
Status: In Production
RoHS: Yes
Part No. Green Version: IM1G16D3EDBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

Download

Datasheet
Datasheet version 1.0 / 05.05.2017
Environmental Informations
REACH Notification
RoHS Notification
Statement Conflict Materials


Request Email

IM1G16D3FDB

Technical Specifications

Capacity: 1Gb
Organization: x16
Package: BGA96
Voltage: 1.35V
Status: In Production
RoHS: Yes
Part No. Green Version: IM1G16D3FDBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1333 667MHz 1.5ns
DDR3-1600 800MHz 1.25ns
DDR3-1866
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 95°C tC
tC = Operating Case temperature

Download

Datasheet
Datasheet version 1.0 / 05.05.2017
Environmental Informations
REACH Notification
RoHS Notification
Statement Conflict Materials


Request Email

IM1G16D3FFB

Technical Specifications

Capacity: 1Gb
Organization: x16
Package: BGA96
Voltage: 1.35V
Status: CS Sept 2017
RoHS: Yes
Part No. Green Version: IM1G16D3FFBG
  Leaded versions are available on request
Speed-Grade
Data-Rate Clock Rate Cycle Time
DDR3-1866 933MHz 1.07ns
Temperature Grade

* C = Commercial Temp, I = Industrial Temp

C: 0°C to 95°C tC
I: -40°C to 105°C tC
tC = Operating Case temperature

* C = Commercial Temp, I = Industrial Temp, H = High Temp, X = Extreme Temp